Supersedes IPC/JEDEC J-STD .. Mass Reflow This standard applies to bulk solder reflow assembly by convection, convection/IR. Joint IPC/JEDEC Standard J-STD Page 1. STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW. SENSITIVE SURFACE. J-STDD. – Published August – Typos corrected 3/08 (Rev D.1). • J- STD – Published August • J-STDC. – Balloted within JEDEC & IPC.

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Other suggestions for document improvement: Table lists equivalent derated? General Considerations for Baking Impose following two exposure conditions: Table summarizes conditions for resetting or pausing the?

This can be accomplished by dry pack according to Clause 3. If the bag is to be resealed refer to Clause 4. Amol Kirtikar, Sud-Chemie Inc.

Spots without printing shall be tested. These methods are provided to avoid damage from moisture absorption and exposure to solder re? HIC Testing Method To function properly, the spots must show a visually perceptible color change to indicate a change in the amount of humidity. For components exposed anytime less than their stated? If the time limit is exceeded the packages should be baked according to Table to restore the?


J-STD Bake Conditions

Also the actual bake time may be reduced if technically justi? The caution label shall be jdec to the outside surface of the MBB.

It does not apply to bulk solder re? The body temperature during re? Paper and Plastic Container Items The caution label is not required if a bar code label includes the Level 1 classi? i;c

An equivalency evaluation is recommended to ensure that high temperature processing maintains moisture jedex gain to an acceptable level. This may present an additional risk, which should be evaluated.

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Storage in a dry cabinet may be considered equivalent to storage in a dry pack with unlimited shelf life. It can occur due to misprocessing e.

Individuals or companies are invited to submit comments to IPC. The period between drying and sealing must not exceed the MET less the time allowed for distributors to open the bags and repack parts.

The colors shall be described in writing on the card. No moisture-absorbing material e. Allow the cards to condition for a minimum of 24 hours. If a higher bake temperature is required, SMD packages must be removed from the low temperature carriers to thermally safe carriers, baked, and returned to the low temperature carriers.


Peak package body temperature: All testing occurs inside the chamber, while the cards are exposed to the test humidity.

I recommend changes to the following: After bake, must be re? This value should to be obtained from the desiccant manufacturer.

Non-semiconductor devices may exhibit additional process sensitivities beyond moisture sensitivity such as thermal sensitivity,? When dry packing, the desiccant shall be removed from the storage container just prior to placing it into the MBB and sealing the MBB.

Level 1 parts classi? Users may reduce the actual bake time if technically justi? Table gives conditions for rebake of SMD packages at a user site after the? Such processes are not allowed for many SMDs and are not covered by the component quali?